Ministry of Electronics and Information Technology,

Government of India

इलेक्ट्रॉनिक्स और सूचना प्रौद्योगिकी मंत्रालय, भारत सरकार

Production Linked Incentive Scheme (PLI) for Large Scale Electronics Manufacturing

Financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain including electronic components and semiconductor packaging

Production Linked Incentive Scheme (PLI)

Providing level playing field for domestic
electronics manufacturing sector

Production Linked Incentive Scheme (PLI)

Positioning India as a global hub for Electronics
System Design and Manufacturing (ESDM)

Honourable Union Minister
Shri Ashwini Vaishnaw
Honourable Union Minister of State
Shri Rajeev Chandrasekhar

Second Round of Production Linked Incentive Scheme (PLI) for Large Scale Electronics Manufacturing

Financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain including electronic components and semiconductor packaging

Objective:

The Production Linked Incentive Scheme (PLI) for Large Scale Electronics Manufacturing proposes a financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain including electronic components and semiconductor packaging

Eligibility:

Support under the Scheme shall be provided only to companies engaged in manufacturing of target segment in India.

Tenure of the Scheme

Support under the Scheme shall be provided for a period of four (4) years. The incentive shall be applicable from 1.04.2021. Base year for the purpose of Second Round shall be FY 2019-20.

Target Segments

The Scheme shall only be applicable for specified electronic components:

S.No Description of Goods
1 Specified Electronic Components
1.1 SMT components
1.2 Discrete semiconductor devices including transistors, diodes, thyristors, etc.
1.3 Passive components including resistors, capacitors, etc. for electronic applications
1.4 Printed Circuit Boards (PCB), PCB laminates, prepregs, photopolymer films, PCB printing inks
1.5 Sensors, transducers, actuators, crystals for electronic applications
1.6 System in Package (SIP)
1.7 Micro / Nano-electronic components such as Micro Electromechanical Systems (MEMS) and Nano Electromechanical Systems (NEMS)
1.8 Assembly, Testing, Marking and Packaging (ATMP) units

First Round of Production Linked Incentive Scheme (PLI) for Large Scale Electronics

Financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain
including electronic components and semiconductor packaging

Objective:

The Production Linked Incentive Scheme (PLI) for Large Scale Electronics Manufacturing proposes a financial incentive to boost domestic manufacturing and attract large investments in the electronics value chain including electronic components and semiconductor packaging

Target Segments

The Scheme shall only be applicable for target segments namely mobile phones and specified electronic components

Eligibility:

Support under the Scheme shall be provided only to companies engaged in manufacturing of target segments in India.

Tenure of the Scheme

Support under the Scheme shall be provided for a period of five (5) years subsequent to the base year